ProductsStandard ICsPackaging

Package outline drawings

In Datasheets
Package outline drawings can be found in most of our product datasheets. The exceptions are some of our HC/T and HEF products. Their package outline drawings are below:
Stand Alone
Below are stand-alone package outline drawings that are used in Standard ICs. A listing of all NXP Semiconductors package outline drawings can be found at the bottom of this page.
Note: All packages are plastic unless otherwise noted. Listed width and length are nominal package body dimensions. Listed height is maximum installed package height.

Index

BGA (Ball Grid Array)

  • Ordering Code Suffix: BGA = G
SOT NumberBallsAttributes
256Body 17mm square, height 1.95mm, ball pitch 1mm
Note: Also, see LFBGA.

DBS (DIL Bent SIL)

  • Ordering Code Suffix: DBS = J
  • Ordering Code Suffix: DBS = Q
SOT NumberPinsAttributes
9Width 4.5mm, length 23.8mm, height 12mm, mounted height 17mm, lead pitch 2.54mm
9Width 2.5mm, length 13mm, height 14.5mm, mounted height 21.4mm, lead pitch 1.27mm
13Width 4.5mm, length 23.8mm, height 12mm, mounted height 17mm, lead pitch 1.7mm
17Width 4.5mm, length 23.8mm, height 12mm, mounted height 17mm, lead pitch 1.27mm
23Width 4.45mm, length 30.15mm, height 12mm, mounted height 16.9mm, lead pitch 1.27mm
Note: Also, see SIL.

DIL (Dual In-Line)

Note: These packages are also known as Dual In-line Package (DIP).
  • Ordering Code Suffix: DIL = N
  • Ordering Code Suffix: DIL = D (All HEF Devices)
  • Ordering Code Suffix: DIL = P (All PCF and Some PCA Devices)
  • Ordering Code Suffix: DIL = N2 (All SAA Devices)
SOT NumberPinsAttributes
8300mil, slim corner leads, width 0.25", length 0.375", height 0.17", lead pitch 0.1" IEC 050G01, JEDEC MO-001, JEITA SC-504-8 compliant
14300mil, width 0.25", length 0.75", height 0.17", lead pitch 0.1" IEC 050G04, JEDEC MO-001, JEITA SC-501-14 compliant
16300mil, long body, width 0.25", length 0.85", height 0.19", lead pitch 0.1" IEC 050G09, JEDEC MO-001, JEITA SC-503-16 compliant
16300mil, short body, slim corner leads, width 0.25", length 0.75", height 0.17", lead pitch 0.1"
20300mil, width 0.245", length 1.0525", height 0.17", lead pitch 0.1" JEDEC MS-001, JEITA SC-603 compliant
24600mil, wide/long body, width 0.55", length 1.25", height 0.2", lead pitch 0.1" IEC 051G02, JEDEC MO-015, JEITA SC-509-24 compliant
24300mil, narrow/long body, width 0.2555", length 1.248", height 0.185", lead pitch 0.1" JEDEC MS-001 compliant
28600mil, short body, width 0.55", length 1.375", height 0.2", lead pitch 0.1" IEC 051G05, JEDEC MS-015, JEITA SC-510-28 compliant
28600mil, long body, width 0.5525", length 1.4375", height 0.2", lead pitch 0.1" IEC 051G06, JEDEC MS-011, JEITA SC-510-28 compliant
40600mil, width 0.55", length 2.0475", height 0.19", lead pitch 0.1" IEC 051G08, JEDEC MO-015, JEITA SC-511-40 compliant
48600mil, width 0.545", length 2.44", height 0.19", lead pitch 0.1" JEDEC MS-011
Note: Also, see HDIP.

DQFN (Depopulated very-thin Quad Flat-pack; No-leads) a.k.a.
DHVQFN (Depopulated Heatsink Very-thin Quad Flat-pack; No-leads)

Note: These packages are dual in-line compatible.
  • Ordering Code Suffix: DQFN/DHVQFN = BQ
SOT NumberPadsAttributes
14Width 2.5mm, length 3mm, height 1mm, pad pitch 0.5mm JEDEC MO-241 compliant
16Width 2.5mm, length 3.5mm, height 1mm, pad pitch 0.5mm JEDEC MO-241 compliant
20Width 2.5mm, length 4.5mm, height 1mm, pad pitch 0.5mm JEDEC MO-241 compliant
24Width 3.5mm, length 5.5mm, height 1mm, pad pitch 0.5mm

HBCC (Heatsink Bottom Chip Carrier)

  • Ordering Code Suffix: HBCC = W
SOT NumberPadsAttributes
24Body 4mm square, height 0.8mm, pad pitch 0.5mm JEDEC MO-217 compliant

HDIP (Heat-dissipating Dual In-line Package)

  • Ordering Code Suffix: HDIP = P
SOT NumberPinsAttributes
18Width 6.35mm, length 21.55mm, height 4.7mm, lead pitch 2.54mm

HSOP (Heatsink Small Outline Package)

  • Ordering Code Suffix: HSOP = TH
SOT NumberPinsAttributes
24Low stand-off height, width 11mm, length 15.9mm, height 3.5mm, lead pitch 1mm

HTSSOP (Heatsink Thin Shrink Small Outline Package)

  • Ordering Code Suffix: HTSSOP = TW
SOT NumberPinsAttributes
20Width 4.4mm, length 6.5mm, height 1.1mm, lead pitch 0.65mm JEDEC MO-153 compliant
32Width 6.1mm, length 11mm, height 1.1mm, lead pitch 0.65mm JEDEC MO-153 compliant

HVQFN (Heatsink Very-thin Quad Flat-pack; No-leads)

  • Ordering Code Suffix: HVQFN = BS
SOT NumberPadsAttributes
16Body 4mm square, height 1mm, pad pitch 0.65mm JEDEC MO-220 compliant
16Body 3mm square, height 1mm, pad pitch 0.5mm JEDEC MO-220 compliant
20Body 5mm square, height 1mm, pad pitch 0.65mm JEDEC MO-220 compliant
20Width 5mm, length 6mm, height 1mm, pad pitch 0.8mm JEDEC MO-220 compliant
24Body 4mm square, height 1mm, pad pitch 0.5mm JEDEC MO-220 compliant
24Body 3mm square, height 0.85mm, pad pitch 0.4mm
28Body 6mm square, height 1mm, pad pitch 0.5mm JEDEC MO-220 compliant
32Body 5mm square, height 1mm, pad pitch 0.5mm JEDEC MO-220 compliant
48Body 7mm square, height 1mm, pad pitch 0.5mm JEDEC MO-220 compliant
48Body 6mm square, height 1mm, pad pitch 0.4mm
48Larger heatsink, body 6mm square, height 1mm, pad pitch 0.4mm
56Body 8mm square, height 1mm, pad pitch 0.5mm JEDEC MO-220 compliant
64Body 9mm square, height 1mm, pad pitch 0.5mm JEDEC MO-220 compliant
Note: Also, see HWQFN.

HVSON (Heatsink Very-thin Small Outline; No-leads)

  • Ordering Code Suffix: HVSON = TK
SOT NumberPadsAttributes
8Body 3mm square, height 1mm, pad pitch 0.5mm JEDEC MO-229 compliant
8Body 4mm square, height 1mm, pad pitch 0.8mm JEDEC MO-229 compliant
10Body 3mm square, height 1mm, pad pitch 0.5mm JEDEC MO-229 compliant
Note: Also, see HWSON and HXSON.

HWQFN (Heatsink Very-Very-thin Quad Flat-pack; No-leads)

  • Ordering Code Suffix: HWQFN = HF
SOT NumberPadsAttributes
24Body 4mm square, height 0.8mm, pad pitch 0.5mm JEDEC MO-220 compliant
48Body 7mm square, height 0.8mm, pad pitch 0.5mm
56Width 5mm, length 11mm, height 0.8mm, pad pitch 0.5mm
Note: Also, see HVQFN.

HWSON (Heatsink Very-Very-thin Small Outline package; No leads)

  • Ordering Code Suffix: HWSON-8 = TP
SOT NumberPadsAttributes
8Width 3mm, length 2mm, height 0.8mm, pad 0.5mm JEDEC MO-229 compatible
Note: Also, see HVSON and HXSON.

HXSON (Heatsink eXtremely Small Outline Package; No leads)

  • Ordering Code Suffix: HXSON-8 = TL
SOT NumberPadsAttributes
8Width 3mm, length 2mm, height 0.5mm, pad pitch 0.5mm JEDEC MO-229 compliant
Note: Also, see HVSON and HWSON.

LFBGA (Low-profile Fine-pitch Ball Grid Array)

  • Ordering Code Suffix: LFBGA = EC
  • Ordering Code Suffix: LFBGA = F (LH7 and LH7A Devices Only)
SOT NumberBallsAttributes
64Body 6mm square, height 1.5mm, ball pitch 0.5mm
72Body 7mm square, height 1.5mm, ball pitch 0.5mm
81Body 9mm square, height 1.6mm, ball pitch 0.8mm JEDEC MO-205 compliant
96Width 13.5mm, length 5.5mm, height 1.5mm, ball pitch 0.8mm
114Width 16mm, length 5.5mm, height 1.5mm, ball pitch 0.8mm
208Body 14mm square, height 1.7mm, ball pitch 0.8mm
256Body 14mm square, height 1.7mm, ball pitch 0.8mm
320Body 13mm square, height 1.3mm, ball pitch 0.5mm
324Body 17mm square, height 1.7mm, ball pitch 0.8mm
Note: Also, see BGA.

LQFP (Low-profile Quad Flat Pack)

  • Ordering Code Suffix: LQFP = BD (All Logic and Microcontroller Devices)
  • Ordering Code Suffix: LQFP = B (All 16C Devices)
  • Ordering Code Suffix: LQFP = BE (All SC28 Devices)
  • Ordering Code Suffix: LQFP = Q (All LH7 and LH7A Devices)
SOT NumberPinsAttributes
32Body 7mm square, height 1.6mm, lead pitch 0.8mm IEC 136E03, JEDEC MS-026 compliant
44Body 10mm square, height 1.6mm, lead pitch 0.8mm IEC 136E08, JEDEC MS-026 compliant
48Body 7mm square, height 1.6mm, lead pitch 0.5mm IEC 136E05, JEDEC MS-026 compliant
64Body 10mm square, height 1.6mm, lead pitch 0.5mm IEC 136E10, JEDEC MS-026 compliant
64Body 7mm square, height 1.6mm, lead pitch 0.4mm IEC 136E06, JEDEC MS-026 compliant
64Body 14mm square, height 1.6mm, lead pitch 0.8mm IEC 136E18, JEDEC MS-026, JEITA ED-7311EC compliant
80Body 12mm square, height 1.6mm, lead pitch 0.5mm IEC 136E15, JEDEC MS-026 compliant
100Body 14mm square, height 1.6mm, lead pitch 0.5mm IEC 136E20, JEDEC MS-026 compliant
144Body 20mm square, height 1.6mm, lead pitch 0.5mm IEC 136E23, JEDEC MS-026 compliant
176Body 20mm square, height 1.6mm, lead pitch 0.4mm JEDEC MS-026 compliant
208Body 28mm square, height 1.6mm, lead pitch 0.5mm IEC 136E30, JEDEC MS-026 compliant

PicoGate

  • Ordering Code Suffix: SC-74/A = GV
  • Ordering Code Suffix: SC-88/A = GW
SOT NumberPinsAttributes
5Smaller, flat body ends, width 1.25mm, length 2mm, height 1.1mm, lead pitch 0.65mm JEITA SC-88A compliant and SC70-5, SOT323, MO-203, SSOP-5-P-0.65A, USV compatible
5Smaller, tapered body ends, width 1.25mm, length 2mm, height 1.1mm, lead pitch 0.65mm JEDEC MO-203 compliant and SC70-5, SOT323, MO-203, SSOP-5-P-0.65A, USV compatible
5Larger, width 1.5mm, length 2.9mm, height 1.1mm, lead pitch 0.95mm JEITA SC-74A compliant and SC59, SOT23(-5), SOT59-5, MO-178, TSOP5, SMV compatible
6Smaller, width 1.25mm, length 2mm, height 1.1mm, lead pitch 0.65mm JEITA SC-88 compliant and SC70-6 compatible
6Larger, width 1.5mm, length 2.9mm, height 1.1mm, lead pitch 0.95mm JEITA SC-74 compliant
Note: Also, see TSSOP and VSSOP.

PLCC (Plastic Leaded Chip Carrier)

  • Ordering Code Suffix: PLCC = A
SOT NumberPinsAttributes
20Body 0.353" square, height 0.18" lead pitch 0.05" IEC 112E04, JEDEC MS-018, JEITA EDR-7319 compliant
28Body 0.453" square, height 0.18" lead pitch 0.05" IEC 112E08, JEDEC MS-018, JEITA EDR-7319 compliant
28Pedestal, body 0.453" square, height 0.18" lead pitch 0.05" IEC 112E08, JEDEC MO-047 compliant
44Body 0.653" square, height 0.18" lead pitch 0.05" IEC 112E10, JEDEC MS-018, JEITA EDR-7319 compliant
52Body 0.753" square, height 0.18" lead pitch 0.05" IEC 112E11, JEDEC MS-018, JEITA EDR-7319 compliant
52Pedestal, body 0.753" square, height 0.18" lead pitch 0.05" IEC 112E11, JEDEC MO-047 compliant
68Body 0.954" square, height 0.18" lead pitch 0.05" IEC 112E10, JEDEC MS-018, JEITA EDR-7319 compliant
68Pedestal, body 0.954" square, height 0.18" lead pitch 0.05" IEC 112E10, JEDEC MO-047 compliant
84Body 1.154" square, height 0.1725" lead pitch 0.05" IEC 112E13, JEDEC MS-018, JEITA EDR-7319 compliant
84Pedestal, body 1.154" square, height 0.1725" lead pitch 0.05" IEC 112E13, JEDEC MO-047 compliant

QFP (Quad Flat Package)

  • Ordering Code Suffix: QFP = BB
SOT NumberPinsAttributes
44Body 10mm square, height 2.1mm, lead pitch 0.8mm
52Higher stand-off, body 10mm square, height 2.45mm, lead pitch 0.65mm JEDEC MS-022 compliant
52Lower stand-off, body 10mm square, height 2.45mm, lead pitch 0.65mm IEC 135E04, JEDEC MS-022 compliant
80Higher stand-off; width 14mm, length 20mm, height 3.3mm, lead pitch 0.8mm JEDEC MO-112 compliant
80Lower stand-off; width 14mm, length 20mm, height 3.2mm, lead pitch 0.8mm JEDEC MO-112 compliant

QSOP (Quarter Size Outline Package)

  • Ordering Code Suffix: QSOP (16 and 20 pins) = DS
  • Ordering Code Suffix: QSOP (24 pin) = DK
SOT NumberPinsAttributes
16Width 3.9mm, length 4.9mm, height 1.73mm, lead pitch 0.635mm
20Width 3.9mm, length 8.7mm, height 1.73mm, lead pitch 0.635mm JEDEC MO-137 compliant
24Width 3.9mm, length 8.7mm, height 1.73mm, lead pitch 0.635mm JEDEC MO-137 compliant

RBS (Rectangular-Bent Single in-line)

SOT NumberPinsAttributes
9Width 6.34mm, length 21.6mm, height 3.7mm, lead pitch 2.54mm
Note: Also, see SIL.

SIL(Single In-Line)

  • Ordering Code Suffix: SIL = S
  • Ordering Code Suffix: SIL (with fin) = SF
SOT NumberPinsAttributes
9Width 3.7mm, length 21.6mm, height 6.34mm, mounted height 18.5mm, lead pitch 2.54mm
9Width 4.5mm, length 23.8mm, height 12mm, mounted height 14mm, lead pitch 2.54mm
Note: Also, see DBS and RBS.

SO (Small Outline)

  • Ordering Code Suffix: SO = D
  • Ordering Code Suffix: SO = T (All PCF and Some PCA Devices)
  • Ordering Code Suffix: DIL = TN2 (All SAA Devices)
SOT NumberPinsAttributes
8Small body, width 3.9mm, length 4.9mm, height 1.75mm, lead pitch 0.05" IEC 076E03, JEDEC MS-012 compliant
8Large body, width 7.5mm, length 7.55mm, height 2.65mm, lead pitch 0.05"
14Width 3.9mm, length 8.65mm, height 1.75mm, lead pitch 0.05" IEC 076E06, JEDEC MS-012 compliant
16Narrow body, width 3.9mm, length 9.9mm, height 1.75mm, lead pitch 0.05" IEC 076E07, JEDEC MS-012 compliant
16Narrow body, low stand-off, width 3.9mm, length 9.9mm, height 1.65mm, lead pitch 0.05" IEC 076E07, JEDEC MS-012 compliant
16Wide body, width 7.5mm, length 10.3mm, height 2.65mm, lead pitch 0.05" IEC 075E03, JEDEC MS-013 compliant
20Width 7.5mm, length 12.8mm, height 2.65mm, lead pitch 0.05" IEC 075E04, JEDEC MS-013 compliant
24Width 7.5mm, length 15.4mm, height 2.65mm, lead pitch 0.05" IEC 075E05, JEDEC MS-013 compliant
28Width 7.5mm, length 17.9mm, height 2.65mm, lead pitch 0.05" IEC 075E06, JEDEC MS-013 compliant
32Width 7.5mm, length 20.5mm, height 2.65mm, lead pitch 0.05" JEDEC MO-119 compliant
Note: Also, see HSOP.

SSOP-II (Shrink Small Outline Package)

  • Ordering Code Suffix: SSOP-II = DB
  • Ordering Code Suffix: SSOP-II = TS (All PCF Devices)
SOT NumberPinsAttributes
14Width 5.3mm, length 6.2mm, height 2mm, lead pitch 0.65mm JEDEC MO-150 compliant
16Large body, width 5.3mm, length 6.2mm, height 2mm, lead pitch 0.65mm JEDEC MO-150 compliant
16Small body, width 4.4mm, length 5.2mm, height 1.5mm, lead pitch 0.65mm JEDEC MO-152 compliant
20Small body, width 4.4mm, length 6.5mm, height 1.5mm, lead pitch 0.65mm JEDEC MO-152 compliant
20Large body, width 5.3mm, length 7.2mm, height 2mm, lead pitch 0.65mm JEDEC MO-150 compliant
24Width 5.3mm, length 8.2mm, height 2mm, lead pitch 0.65mm JEDEC MO-150 compliant
28Width 5.3mm, length 10.2mm, height 2mm, lead pitch 0.65mm JEDEC MO-150 compliant

SSOP-III (Shrink Small Outline Package)

  • Ordering Code Suffix: SSOP-III = DL
SOT NumberPinsAttributes
48Width 7.5mm, length 15.875mm, height 2.8mm JEDEC MO-118 compliant
56Width 7.5mm, length 18.425mm, height 2.8mm JEDEC MO-118 compliant

TFBGA (Thin Fine-pitch Ball Grid Array)

  • Ordering Code Suffix: TFBGA = EE (CBT Devices)
  • Ordering Code Suffix: TFBGA = ET (16C, LPC2000, and SSTU Devices)
  • Ordering Code Suffix: TFBGA = EV (PTN Devices)
SOT NumberBallsAttributes
36Width 3.5mm, length 3.5mm, height 1.15mm, pad pitch 0.5mm
48Width 5mm, length 5mm, height 1.15mm, pad pitch 0.5mm JEDEC MO-195
56Width 4mm, length 4.5mm, height 1.2mm, pad pitch 0.5mm JEDEC MO-195
64Width 7mm, length 7mm, height 1.2mm, pad pitch 0.5mm JEDEC MO-195
144Width 12mm, length 12mm, height 1.2mm, pad pitch 0.8mm
160Width 9mm, length 13mm, height 1.2mm, pad pitch 0.65mm
176Width 6mm, length 15mm, height 1.15mm, pad pitch 0.65mm JEDEC MO-246
180Bevel top; width 12mm, length 12mm, height 1.2mm, pad pitch 0.8mm JEDEC MO-216 compliant
180Square top; width 12mm, length 12mm, height 1.2mm, pad pitch 0.8mm
180Width 10mm, length 10mm, height 1.11mm, pad pitch 0.5mm JEDEC MO-195 compliant
208Square body, width 15mm, length 15mm, height 1.2mm, pad pitch 0.8mm
208Chamfered body, width 15mm, length 15mm, height 1.2mm, pad pitch 0.8mm

TQFP (Thin Quad Flat Package)

  • Ordering Code Suffix: TQFP = H (LCD Drivers)
  • Ordering Code Suffix: TQFP = BC (Microcontrollers)
SOT NumberPinsAttributes
44Body 10mm square, height 1.2mm, lead pitch 0.8mm IEC 137E08, JEDEC MS-026 compliant
64Body 10mm square, height 1.2mm, lead pitch 0.5mm IEC 137E10, JEDEC MS-026 compliant

TSSOP-I (Thin Shrink Small Outline Package)

  • Ordering Code Suffix: TSSOP-I = PW
    (All standard logic 14-pin and higher, all CBT, and some GTL/PCA/PCK devices)
  • Ordering Code Suffix: TSSOP-I = TT
    (All HEF devices)
  • Ordering Code Suffix: TSSOP-I = DH
    (All PTN and some PCK devices)
  • Ordering Code Suffix: TSSOP-I = DP
    (All LM, 8-pin LVC and HC/T, and some GTL/PCA/PCK devices)
SOT NumberPinsAttributes
8Long lead, width 3mm, length 3mm, height 1.1mm, lead pitch 0.65mm
8Short lead, width 3mm, length 3mm, height 1.1mm, lead pitch 0.65mm SM8, SSOP8-P-0.65 compatible
8Wide body, long lead, width 4.4mm, length 3mm, height 1.1mm, lead pitch 0.65mm JEDEC MO-153 compliant
10Width 3mm, length 3mm, height 1.1mm, lead pitch 0.5mm
14Width 4.4mm, length 5mm, height 1.1mm, lead pitch 0.65mm JEDEC MO-153 compliant
16Width 4.4mm, length 5mm, height 1.1mm, lead pitch 0.65mm JEDEC MO-153 compliant
20Width 4.4mm, length 6.5mm, height 1.1mm, lead pitch 0.65mm JEDEC MO-153 compliant
24Width 4.4mm, length 7.8mm, height 1.1mm, lead pitch 0.65mm JEDEC MO-153 compliant
28Width 4.4mm, length 9.7mm, height 1.1mm, lead pitch 0.65mm JEDEC MO-153 compliant
Note: Also, see HTSSOP.

TSSOP-II (Thin Shrink Small Outline Package)

  • Ordering Code Suffix: TSSOP-II (32 pin) = DR
  • Ordering Code Suffix: TSSOP-II (48 to 64 pins) = DGG
SOT NumberPinsAttributes
32Width 6.1mm, length 11mm, height 1.1mm, lead pitch 0.65mm JEDEC MO-153 compliant
38Width 4.4mm, length 9.7mm, height 1.1mm, lead pitch 0.5mm JEDEC MO-153 compliant
48Width 6.1mm, length 12.5mm, height 1.2mm, lead pitch 0.5mm JEDEC MO-153 compliant
56Width 6.1mm, length 14mm, height 1.2mm, lead pitch 0.5mm JEDEC MO-153 compliant
64Width 6.1mm, length 17mm, height 1.2mm, lead pitch 0.5mm JEDEC MO-153 compliant
Note: Also, see TVSOP and HTSSOP.

TVSOP (Thin Very Small Outline Package)

  • Ordering Code Suffix: TVSOP (48 to 56 pins) = DGV
  • Ordering Code Suffix: TVSOP (80 pin) = DGB
SOT NumberPinsAttributes
48Width 4.4mm, length 9.7mm, height 1.1mm, lead pitch 0.4mm JEDEC MO-153 compliant
56Width 4.4mm, length 11.3mm, height 1.2mm, lead pitch 0.4mm JEDEC MO-194 compliant
80Width 6.1mm, length 17mm, height 1.2mm, lead pitch 0.4mm JEDEC MO-153 compliant

VFBGA (Very thin Fine-pitch Ball Grid Array)

  • Ordering Code Suffix: VFBGA = EV
SOT NumberBallsAttributes
56Width 7mm, length 4.7mm, height 1mm, pad pitch 0.65mm, JEDEC MO-225 compliant
56Width 4mm, length 4.5mm, height 1mm, pad pitch 0.5mm

VSO (Very Small Outline)

  • Ordering Code Suffix: VSO = T
SOT NumberPinsAttributes
40Width 7.55mm, length 15.4mm, height 2.7mm, lead pitch 0.03"
56Width 11.05mm, length 21.5mm, height 3.3mm, lead pitch 0.75mm

VSSOP (Very thin Shrink Small Outline Package)

  • Ordering Code Suffix: VSSOP = DC
SOT NumberPinsAttributes
8Width 2.3mm, length 2mm, height 1mm, lead pitch 0.5mm JEDEC MO-187 compliant and US8 compatible

XQFN (eXtremely thin Quad Flat package; No leads)

Note: As indicated, some of these packages are also known as MicroPak.
  • Ordering Code Suffix: XQFN = GM
SOT NumberPinsAttributes
8Body 1.6mm square, height 0.5mm, lead pitch 0.5mm JEDEC MO-255 compliant and MicroPak 8 compatible
10Width 1.55mm, length 2.0mm, height 0.5mm, lead pitch 0.5mm JEDEC MO-255 compliant

XSON (eXtremely thin Small Outline package; No leads)

Note: As indicated, some of these packages are also known as MicroPak.
Note: As indicated, some of these packages are NanoStar compatible.
  • Ordering Code Suffix: XSON-6 (0.35mm lead pitch) = GF
  • Ordering Code Suffix: XSON-6 (0.5mm lead pitch) = GM
  • Ordering Code Suffix: XSON-8 = GT
SOT NumberPinsAttributes
6Width 1mm, length 1.45mm, height 0.5mm, lead pitch 0.5mm JEDEC MO-252 compliant and MicroPak 6, NanoStar 6 compatible
6Width 1mm, length 1mm, height 0.5mm, lead pitch 0.35mm
8Width 1mm, length 1.95mm, height 0.5mm, lead pitch 0.5mm JEDEC MO-252 compliant and NanoStar 8 compatible
8Wide body, width 3mm, length 2mm, height 0.5mm, lead pitch 0.5mm VSSOP-8 footprint compatible
Note: Also, see HXSON.
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