Family and package overview

Much of our product quality and reliability information is based on manufacturing processes and packaging. The tables below give you an overview of how and where our product families are produced as well as where our different packages are assembled and tested.

You can determine the actual diffusion, assembly, and final-test center of a given device by examining its package markings or its product ID label.

Family	Process	Diffusion Center(s)
ABT	BiCMOS	U
AHC/T	CMOS	U
ALVC	CMOS	b, T
ALVT	BiCMOS	U
AUC	CMOS	T
AVC	CMOS	T
FAST	Bipolar	Y
HC/T	CMOS	U
HEF	CMOS	U
LV	CMOS	U
LVC	CMOS	e, U
LVT	BiCMOS	U
MB	BiCMOS	U

Package	Assembly/Test Center(s)
PicoGate	P, 2
DIL	n, S
SO	n, R
SSOP	f, n, u, P, R
TSSOP	f, n, u, P, R
PLCC	h, S
QFP	v, P, S
LFBGA	u

• Standard ICs Diffusion Centers
• Standard ICs Assembly and Final-Test Centers

• Package Markings Page
• Product Identification Label Page