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Package outline drawings
In Datasheets
Package outline drawings can be found in most of our product datasheets.
The exceptions are some of our HC/T and HEF products.
Their package outline drawings are below:
Stand Alone
Below are stand-alone package outline drawings that are used in Standard ICs.
A listing of all NXP Semiconductors package outline drawings can be found at the bottom of this page.
Note:
All packages are plastic unless otherwise noted.
Listed width and length are nominal package body dimensions.
Listed height is maximum installed package height.
Index
BGA (Ball Grid Array)
- Ordering Code Suffix: BGA = G
| SOT Number | Balls | Attributes |
| 256 | Body 17mm square, height 1.95mm, ball pitch 1mm |
DBS (DIL Bent SIL)
- Ordering Code Suffix: DBS = J
- Ordering Code Suffix: DBS = Q
| SOT Number | Pins | Attributes |
| 9 | Width 4.5mm, length 23.8mm, height 12mm, mounted height 17mm, lead pitch 2.54mm |
| 9 | Width 2.5mm, length 13mm, height 14.5mm, mounted height 21.4mm, lead pitch 1.27mm |
| 13 | Width 4.5mm, length 23.8mm, height 12mm, mounted height 17mm, lead pitch 1.7mm |
| 17 | Width 4.5mm, length 23.8mm, height 12mm, mounted height 17mm, lead pitch 1.27mm |
| 23 | Width 4.45mm, length 30.15mm, height 12mm, mounted height 16.9mm, lead pitch 1.27mm |
DIL (Dual In-Line)
Note: These packages are also known as Dual In-line Package (DIP).
- Ordering Code Suffix: DIL = N
- Ordering Code Suffix: DIL = D (All HEF Devices)
- Ordering Code Suffix: DIL = P (All PCF and Some PCA Devices)
- Ordering Code Suffix: DIL = N2 (All SAA Devices)
| SOT Number | Pins | Attributes |
| 8 | 300mil, slim corner leads, width 0.25", length 0.375", height 0.17", lead pitch 0.1" IEC 050G01, JEDEC MO-001, JEITA SC-504-8 compliant |
| 14 | 300mil, width 0.25", length 0.75", height 0.17", lead pitch 0.1" IEC 050G04, JEDEC MO-001, JEITA SC-501-14 compliant |
| 16 | 300mil, long body, width 0.25", length 0.85", height 0.19", lead pitch 0.1" IEC 050G09, JEDEC MO-001, JEITA SC-503-16 compliant |
| 16 | 300mil, short body, slim corner leads, width 0.25", length 0.75", height 0.17", lead pitch 0.1" |
| 20 | 300mil, width 0.245", length 1.0525", height 0.17", lead pitch 0.1" JEDEC MS-001, JEITA SC-603 compliant |
| 24 | 600mil, wide/long body, width 0.55", length 1.25", height 0.2", lead pitch 0.1" IEC 051G02, JEDEC MO-015, JEITA SC-509-24 compliant |
| 24 | 300mil, narrow/long body, width 0.2555", length 1.248", height 0.185", lead pitch 0.1" JEDEC MS-001 compliant |
| 28 | 600mil, short body, width 0.55", length 1.375", height 0.2", lead pitch 0.1" IEC 051G05, JEDEC MS-015, JEITA SC-510-28 compliant |
| 28 | 600mil, long body, width 0.5525", length 1.4375", height 0.2", lead pitch 0.1" IEC 051G06, JEDEC MS-011, JEITA SC-510-28 compliant |
| 40 | 600mil, width 0.55", length 2.0475", height 0.19", lead pitch 0.1" IEC 051G08, JEDEC MO-015, JEITA SC-511-40 compliant |
| 48 | 600mil, width 0.545", length 2.44", height 0.19", lead pitch 0.1" JEDEC MS-011 |
DQFN (Depopulated very-thin Quad Flat-pack; No-leads) a.k.a. DHVQFN (Depopulated Heatsink Very-thin Quad Flat-pack; No-leads)
Note: These packages are dual in-line compatible.
- Ordering Code Suffix: DQFN/DHVQFN = BQ
| SOT Number | Pads | Attributes |
| 14 | Width 2.5mm, length 3mm, height 1mm, pad pitch 0.5mm JEDEC MO-241 compliant |
| 16 | Width 2.5mm, length 3.5mm, height 1mm, pad pitch 0.5mm JEDEC MO-241 compliant |
| 20 | Width 2.5mm, length 4.5mm, height 1mm, pad pitch 0.5mm JEDEC MO-241 compliant |
| 24 | Width 3.5mm, length 5.5mm, height 1mm, pad pitch 0.5mm |
HBCC (Heatsink Bottom Chip Carrier)
- Ordering Code Suffix: HBCC = W
| SOT Number | Pads | Attributes |
| 24 | Body 4mm square, height 0.8mm, pad pitch 0.5mm JEDEC MO-217 compliant |
HDIP (Heat-dissipating Dual In-line Package)
- Ordering Code Suffix: HDIP = P
| SOT Number | Pins | Attributes |
| 18 | Width 6.35mm, length 21.55mm, height 4.7mm, lead pitch 2.54mm |
HSOP (Heatsink Small Outline Package)
- Ordering Code Suffix: HSOP = TH
| SOT Number | Pins | Attributes |
| 24 | Low stand-off height, width 11mm, length 15.9mm, height 3.5mm, lead pitch 1mm |
HTSSOP (Heatsink Thin Shrink Small Outline Package)
- Ordering Code Suffix: HTSSOP = TW
| SOT Number | Pins | Attributes |
| 20 | Width 4.4mm, length 6.5mm, height 1.1mm, lead pitch 0.65mm JEDEC MO-153 compliant |
| 32 | Width 6.1mm, length 11mm, height 1.1mm, lead pitch 0.65mm JEDEC MO-153 compliant |
HVQFN (Heatsink Very-thin Quad Flat-pack; No-leads)
- Ordering Code Suffix: HVQFN = BS
| SOT Number | Pads | Attributes |
| 16 | Body 4mm square, height 1mm, pad pitch 0.65mm JEDEC MO-220 compliant |
| 16 | Body 3mm square, height 1mm, pad pitch 0.5mm JEDEC MO-220 compliant |
| 20 | Body 5mm square, height 1mm, pad pitch 0.65mm JEDEC MO-220 compliant |
| 20 | Width 5mm, length 6mm, height 1mm, pad pitch 0.8mm JEDEC MO-220 compliant |
| 24 | Body 4mm square, height 1mm, pad pitch 0.5mm JEDEC MO-220 compliant |
| 24 | Body 3mm square, height 0.85mm, pad pitch 0.4mm |
| 28 | Body 6mm square, height 1mm, pad pitch 0.5mm JEDEC MO-220 compliant |
| 32 | Body 5mm square, height 1mm, pad pitch 0.5mm JEDEC MO-220 compliant |
| 48 | Body 7mm square, height 1mm, pad pitch 0.5mm JEDEC MO-220 compliant |
| 48 | Body 6mm square, height 1mm, pad pitch 0.4mm |
| 48 | Larger heatsink, body 6mm square, height 1mm, pad pitch 0.4mm |
| 56 | Body 8mm square, height 1mm, pad pitch 0.5mm JEDEC MO-220 compliant |
| 64 | Body 9mm square, height 1mm, pad pitch 0.5mm JEDEC MO-220 compliant |
HVSON (Heatsink Very-thin Small Outline; No-leads)
- Ordering Code Suffix: HVSON = TK
| SOT Number | Pads | Attributes |
| 8 | Body 3mm square, height 1mm, pad pitch 0.5mm JEDEC MO-229 compliant |
| 8 | Body 4mm square, height 1mm, pad pitch 0.8mm JEDEC MO-229 compliant |
| 10 | Body 3mm square, height 1mm, pad pitch 0.5mm JEDEC MO-229 compliant |
HWQFN (Heatsink Very-Very-thin Quad Flat-pack; No-leads)
- Ordering Code Suffix: HWQFN = HF
| SOT Number | Pads | Attributes |
| 24 | Body 4mm square, height 0.8mm, pad pitch 0.5mm JEDEC MO-220 compliant |
| 48 | Body 7mm square, height 0.8mm, pad pitch 0.5mm |
| 56 | Width 5mm, length 11mm, height 0.8mm, pad pitch 0.5mm |
HWSON (Heatsink Very-Very-thin Small Outline package; No leads)
- Ordering Code Suffix: HWSON-8 = TP
| SOT Number | Pads | Attributes |
| 8 | Width 3mm, length 2mm, height 0.8mm, pad 0.5mm JEDEC MO-229 compatible |
HXSON (Heatsink eXtremely Small Outline Package; No leads)
- Ordering Code Suffix: HXSON-8 = TL
| SOT Number | Pads | Attributes |
| 8 | Width 3mm, length 2mm, height 0.5mm, pad pitch 0.5mm JEDEC MO-229 compliant |
LFBGA (Low-profile Fine-pitch Ball Grid Array)
- Ordering Code Suffix: LFBGA = EC
- Ordering Code Suffix: LFBGA = F (LH7 and LH7A Devices Only)
| SOT Number | Balls | Attributes |
| 64 | Body 6mm square, height 1.5mm, ball pitch 0.5mm |
| 72 | Body 7mm square, height 1.5mm, ball pitch 0.5mm |
| 81 | Body 9mm square, height 1.6mm, ball pitch 0.8mm JEDEC MO-205 compliant |
| 96 | Width 13.5mm, length 5.5mm, height 1.5mm, ball pitch 0.8mm |
| 114 | Width 16mm, length 5.5mm, height 1.5mm, ball pitch 0.8mm |
| 208 | Body 14mm square, height 1.7mm, ball pitch 0.8mm |
| 256 | Body 14mm square, height 1.7mm, ball pitch 0.8mm |
| 320 | Body 13mm square, height 1.3mm, ball pitch 0.5mm |
| 324 | Body 17mm square, height 1.7mm, ball pitch 0.8mm |
LQFP (Low-profile Quad Flat Pack)
- Ordering Code Suffix: LQFP = BD (All Logic and Microcontroller Devices)
- Ordering Code Suffix: LQFP = B (All 16C Devices)
- Ordering Code Suffix: LQFP = BE (All SC28 Devices)
- Ordering Code Suffix: LQFP = Q (All LH7 and LH7A Devices)
| SOT Number | Pins | Attributes |
| 32 | Body 7mm square, height 1.6mm, lead pitch 0.8mm IEC 136E03, JEDEC MS-026 compliant |
| 44 | Body 10mm square, height 1.6mm, lead pitch 0.8mm IEC 136E08, JEDEC MS-026 compliant |
| 48 | Body 7mm square, height 1.6mm, lead pitch 0.5mm IEC 136E05, JEDEC MS-026 compliant |
| 64 | Body 10mm square, height 1.6mm, lead pitch 0.5mm IEC 136E10, JEDEC MS-026 compliant |
| 64 | Body 7mm square, height 1.6mm, lead pitch 0.4mm IEC 136E06, JEDEC MS-026 compliant |
| 64 | Body 14mm square, height 1.6mm, lead pitch 0.8mm IEC 136E18, JEDEC MS-026, JEITA ED-7311EC compliant |
| 80 | Body 12mm square, height 1.6mm, lead pitch 0.5mm IEC 136E15, JEDEC MS-026 compliant |
| 100 | Body 14mm square, height 1.6mm, lead pitch 0.5mm IEC 136E20, JEDEC MS-026 compliant |
| 144 | Body 20mm square, height 1.6mm, lead pitch 0.5mm IEC 136E23, JEDEC MS-026 compliant |
| 176 | Body 20mm square, height 1.6mm, lead pitch 0.4mm JEDEC MS-026 compliant |
| 208 | Body 28mm square, height 1.6mm, lead pitch 0.5mm IEC 136E30, JEDEC MS-026 compliant |
PicoGate
- Ordering Code Suffix: SC-74/A = GV
- Ordering Code Suffix: SC-88/A = GW
| SOT Number | Pins | Attributes |
| 5 | Smaller, flat body ends, width 1.25mm, length 2mm, height 1.1mm, lead pitch 0.65mm JEITA SC-88A compliant and SC70-5, SOT323, MO-203, SSOP-5-P-0.65A, USV compatible |
| 5 | Smaller, tapered body ends, width 1.25mm, length 2mm, height 1.1mm, lead pitch 0.65mm JEDEC MO-203 compliant and SC70-5, SOT323, MO-203, SSOP-5-P-0.65A, USV compatible |
| 5 | Larger, width 1.5mm, length 2.9mm, height 1.1mm, lead pitch 0.95mm JEITA SC-74A compliant and SC59, SOT23(-5), SOT59-5, MO-178, TSOP5, SMV compatible |
| 6 | Smaller, width 1.25mm, length 2mm, height 1.1mm, lead pitch 0.65mm JEITA SC-88 compliant and SC70-6 compatible |
| 6 | Larger, width 1.5mm, length 2.9mm, height 1.1mm, lead pitch 0.95mm JEITA SC-74 compliant |
PLCC (Plastic Leaded Chip Carrier)
- Ordering Code Suffix: PLCC = A
| SOT Number | Pins | Attributes |
| 20 | Body 0.353" square, height 0.18" lead pitch 0.05" IEC 112E04, JEDEC MS-018, JEITA EDR-7319 compliant |
| 28 | Body 0.453" square, height 0.18" lead pitch 0.05" IEC 112E08, JEDEC MS-018, JEITA EDR-7319 compliant |
| 28 | Pedestal, body 0.453" square, height 0.18" lead pitch 0.05" IEC 112E08, JEDEC MO-047 compliant |
| 44 | Body 0.653" square, height 0.18" lead pitch 0.05" IEC 112E10, JEDEC MS-018, JEITA EDR-7319 compliant |
| 52 | Body 0.753" square, height 0.18" lead pitch 0.05" IEC 112E11, JEDEC MS-018, JEITA EDR-7319 compliant |
| 52 | Pedestal, body 0.753" square, height 0.18" lead pitch 0.05" IEC 112E11, JEDEC MO-047 compliant |
| 68 | Body 0.954" square, height 0.18" lead pitch 0.05" IEC 112E10, JEDEC MS-018, JEITA EDR-7319 compliant |
| 68 | Pedestal, body 0.954" square, height 0.18" lead pitch 0.05" IEC 112E10, JEDEC MO-047 compliant |
| 84 | Body 1.154" square, height 0.1725" lead pitch 0.05" IEC 112E13, JEDEC MS-018, JEITA EDR-7319 compliant |
| 84 | Pedestal, body 1.154" square, height 0.1725" lead pitch 0.05" IEC 112E13, JEDEC MO-047 compliant |
QFP (Quad Flat Package)
- Ordering Code Suffix: QFP = BB
| SOT Number | Pins | Attributes |
| 44 | Body 10mm square, height 2.1mm, lead pitch 0.8mm |
| 52 | Higher stand-off, body 10mm square, height 2.45mm, lead pitch 0.65mm JEDEC MS-022 compliant |
| 52 | Lower stand-off, body 10mm square, height 2.45mm, lead pitch 0.65mm IEC 135E04, JEDEC MS-022 compliant |
| 80 | Higher stand-off; width 14mm, length 20mm, height 3.3mm, lead pitch 0.8mm JEDEC MO-112 compliant |
| 80 | Lower stand-off; width 14mm, length 20mm, height 3.2mm, lead pitch 0.8mm JEDEC MO-112 compliant |
QSOP (Quarter Size Outline Package)
- Ordering Code Suffix: QSOP (16 and 20 pins) = DS
- Ordering Code Suffix: QSOP (24 pin) = DK
| SOT Number | Pins | Attributes |
| 16 | Width 3.9mm, length 4.9mm, height 1.73mm, lead pitch 0.635mm |
| 20 | Width 3.9mm, length 8.7mm, height 1.73mm, lead pitch 0.635mm JEDEC MO-137 compliant |
| 24 | Width 3.9mm, length 8.7mm, height 1.73mm, lead pitch 0.635mm JEDEC MO-137 compliant |
RBS (Rectangular-Bent Single in-line)
| SOT Number | Pins | Attributes |
| 9 | Width 6.34mm, length 21.6mm, height 3.7mm, lead pitch 2.54mm |
SIL(Single In-Line)
- Ordering Code Suffix: SIL = S
- Ordering Code Suffix: SIL (with fin) = SF
| SOT Number | Pins | Attributes |
| 9 | Width 3.7mm, length 21.6mm, height 6.34mm, mounted height 18.5mm, lead pitch 2.54mm |
| 9 | Width 4.5mm, length 23.8mm, height 12mm, mounted height 14mm, lead pitch 2.54mm |
SO (Small Outline)
- Ordering Code Suffix: SO = D
- Ordering Code Suffix: SO = T (All PCF and Some PCA Devices)
- Ordering Code Suffix: DIL = TN2 (All SAA Devices)
| SOT Number | Pins | Attributes |
| 8 | Small body, width 3.9mm, length 4.9mm, height 1.75mm, lead pitch 0.05" IEC 076E03, JEDEC MS-012 compliant |
| 8 | Large body, width 7.5mm, length 7.55mm, height 2.65mm, lead pitch 0.05" |
| 14 | Width 3.9mm, length 8.65mm, height 1.75mm, lead pitch 0.05" IEC 076E06, JEDEC MS-012 compliant |
| 16 | Narrow body, width 3.9mm, length 9.9mm, height 1.75mm, lead pitch 0.05" IEC 076E07, JEDEC MS-012 compliant |
| 16 | Narrow body, low stand-off, width 3.9mm, length 9.9mm, height 1.65mm, lead pitch 0.05" IEC 076E07, JEDEC MS-012 compliant |
| 16 | Wide body, width 7.5mm, length 10.3mm, height 2.65mm, lead pitch 0.05" IEC 075E03, JEDEC MS-013 compliant |
| 20 | Width 7.5mm, length 12.8mm, height 2.65mm, lead pitch 0.05" IEC 075E04, JEDEC MS-013 compliant |
| 24 | Width 7.5mm, length 15.4mm, height 2.65mm, lead pitch 0.05" IEC 075E05, JEDEC MS-013 compliant |
| 28 | Width 7.5mm, length 17.9mm, height 2.65mm, lead pitch 0.05" IEC 075E06, JEDEC MS-013 compliant |
| 32 | Width 7.5mm, length 20.5mm, height 2.65mm, lead pitch 0.05" JEDEC MO-119 compliant |
SSOP-II (Shrink Small Outline Package)
- Ordering Code Suffix: SSOP-II = DB
- Ordering Code Suffix: SSOP-II = TS (All PCF Devices)
| SOT Number | Pins | Attributes |
| 14 | Width 5.3mm, length 6.2mm, height 2mm, lead pitch 0.65mm JEDEC MO-150 compliant |
| 16 | Large body, width 5.3mm, length 6.2mm, height 2mm, lead pitch 0.65mm JEDEC MO-150 compliant |
| 16 | Small body, width 4.4mm, length 5.2mm, height 1.5mm, lead pitch 0.65mm JEDEC MO-152 compliant |
| 20 | Small body, width 4.4mm, length 6.5mm, height 1.5mm, lead pitch 0.65mm JEDEC MO-152 compliant |
| 20 | Large body, width 5.3mm, length 7.2mm, height 2mm, lead pitch 0.65mm JEDEC MO-150 compliant |
| 24 | Width 5.3mm, length 8.2mm, height 2mm, lead pitch 0.65mm JEDEC MO-150 compliant |
| 28 | Width 5.3mm, length 10.2mm, height 2mm, lead pitch 0.65mm JEDEC MO-150 compliant |
SSOP-III (Shrink Small Outline Package)
- Ordering Code Suffix: SSOP-III = DL
| SOT Number | Pins | Attributes |
| 48 | Width 7.5mm, length 15.875mm, height 2.8mm JEDEC MO-118 compliant |
| 56 | Width 7.5mm, length 18.425mm, height 2.8mm JEDEC MO-118 compliant |
TFBGA (Thin Fine-pitch Ball Grid Array)
- Ordering Code Suffix: TFBGA = EE (CBT Devices)
- Ordering Code Suffix: TFBGA = ET (16C, LPC2000, and SSTU Devices)
- Ordering Code Suffix: TFBGA = EV (PTN Devices)
| SOT Number | Balls | Attributes |
| 36 | Width 3.5mm, length 3.5mm, height 1.15mm, pad pitch 0.5mm |
| 48 | Width 5mm, length 5mm, height 1.15mm, pad pitch 0.5mm JEDEC MO-195 |
| 56 | Width 4mm, length 4.5mm, height 1.2mm, pad pitch 0.5mm JEDEC MO-195 |
| 64 | Width 7mm, length 7mm, height 1.2mm, pad pitch 0.5mm JEDEC MO-195 |
| 144 | Width 12mm, length 12mm, height 1.2mm, pad pitch 0.8mm |
| 160 | Width 9mm, length 13mm, height 1.2mm, pad pitch 0.65mm |
| 176 | Width 6mm, length 15mm, height 1.15mm, pad pitch 0.65mm JEDEC MO-246 |
| 180 | Width 12mm, length 12mm, height 1.2mm, pad pitch 0.8mm JEDEC MO-216 compliant |
| 180 | Width 10mm, length 10mm, height 1.11mm, pad pitch 0.5mm JEDEC MO-195 compliant |
| 208 | Square body, width 15mm, length 15mm, height 1.2mm, pad pitch 0.8mm |
| 208 | Chamfered body, width 15mm, length 15mm, height 1.2mm, pad pitch 0.8mm |
TQFP (Thin Quad Flat Package)
- Ordering Code Suffix: TQFP = H (LCD Drivers)
- Ordering Code Suffix: TQFP = BC (Microcontrollers)
| SOT Number | Pins | Attributes |
| 44 | Body 10mm square, height 1.2mm, lead pitch 0.8mm IEC 137E08, JEDEC MS-026 compliant |
| 64 | Body 10mm square, height 1.2mm, lead pitch 0.5mm IEC 137E10, JEDEC MS-026 compliant |
TSSOP-I (Thin Shrink Small Outline Package)
- Ordering Code Suffix: TSSOP-I = PW
(All standard logic 14-pin and higher, all CBT, and some GTL/PCA/PCK devices)
- Ordering Code Suffix: TSSOP-I = TT
(All HEF devices)
- Ordering Code Suffix: TSSOP-I = DH
(All PTN and some PCK devices)
- Ordering Code Suffix: TSSOP-I = DP
(All LM, 8-pin LVC and HC/T, and some GTL/PCA/PCK devices)
| SOT Number | Pins | Attributes |
| 8 | Long lead, width 3mm, length 3mm, height 1.1mm, lead pitch 0.65mm |
| 8 | Short lead, width 3mm, length 3mm, height 1.1mm, lead pitch 0.65mm SM8, SSOP8-P-0.65 compatible |
| 8 | Wide body, long lead, width 4.4mm, length 3mm, height 1.1mm, lead pitch 0.65mm JEDEC MO-153 compliant |
| 10 | Width 3mm, length 3mm, height 1.1mm, lead pitch 0.5mm |
| 14 | Width 4.4mm, length 5mm, height 1.1mm, lead pitch 0.65mm JEDEC MO-153 compliant |
| 16 | Width 4.4mm, length 5mm, height 1.1mm, lead pitch 0.65mm JEDEC MO-153 compliant |
| 20 | Width 4.4mm, length 6.5mm, height 1.1mm, lead pitch 0.65mm JEDEC MO-153 compliant |
| 24 | Width 4.4mm, length 7.8mm, height 1.1mm, lead pitch 0.65mm JEDEC MO-153 compliant |
| 28 | Width 4.4mm, length 9.7mm, height 1.1mm, lead pitch 0.65mm JEDEC MO-153 compliant |
TSSOP-II (Thin Shrink Small Outline Package)
- Ordering Code Suffix: TSSOP-II (32 pin) = DR
- Ordering Code Suffix: TSSOP-II (48 to 64 pins) = DGG
| SOT Number | Pins | Attributes |
| 32 | Width 6.1mm, length 11mm, height 1.1mm, lead pitch 0.65mm JEDEC MO-153 compliant |
| 38 | Width 4.4mm, length 9.7mm, height 1.1mm, lead pitch 0.5mm JEDEC MO-153 compliant |
| 48 | Width 6.1mm, length 12.5mm, height 1.2mm, lead pitch 0.5mm JEDEC MO-153 compliant |
| 56 | Width 6.1mm, length 14mm, height 1.2mm, lead pitch 0.5mm JEDEC MO-153 compliant |
| 64 | Width 6.1mm, length 17mm, height 1.2mm, lead pitch 0.5mm JEDEC MO-153 compliant |
TVSOP (Thin Very Small Outline Package)
- Ordering Code Suffix: TVSOP (48 to 56 pins) = DGV
- Ordering Code Suffix: TVSOP (80 pin) = DGB
| SOT Number | Pins | Attributes |
| 48 | Width 4.4mm, length 9.7mm, height 1.1mm, lead pitch 0.4mm JEDEC MO-153 compliant |
| 56 | Width 4.4mm, length 11.3mm, height 1.2mm, lead pitch 0.4mm JEDEC MO-194 compliant |
| 80 | Width 6.1mm, length 17mm, height 1.2mm, lead pitch 0.4mm JEDEC MO-153 compliant |
VFBGA (Very thin Fine-pitch Ball Grid Array)
- Ordering Code Suffix: VFBGA = EV
| SOT Number | Balls | Attributes |
| 56 | Width 7mm, length 4.7mm, height 1mm, pad pitch 0.65mm, JEDEC MO-225 compliant |
| 56 | Width 4mm, length 4.5mm, height 1mm, pad pitch 0.5mm |
VSO (Very Small Outline)
- Ordering Code Suffix: VSO = T
| SOT Number | Pins | Attributes |
| 40 | Width 7.55mm, length 15.4mm, height 2.7mm, lead pitch 0.03" |
| 56 | Width 11.05mm, length 21.5mm, height 3.3mm, lead pitch 0.75mm |
VSSOP (Very thin Shrink Small Outline Package)
- Ordering Code Suffix: VSSOP = DC
| SOT Number | Pins | Attributes |
| 8 | Width 2.3mm, length 2mm, height 1mm, lead pitch 0.5mm JEDEC MO-187 compliant and US8 compatible |
XQFN (eXtremely thin Quad Flat package; No leads)
Note: As indicated, some of these packages are also known as MicroPak.
- Ordering Code Suffix: XQFN-8 = GM
| SOT Number | Pins | Attributes |
| 8 | Body 1.6mm square, height 0.5mm, lead pitch 0.5mm JEDEC MO-255 compliant and MicroPak 8 compatible |
XSON (eXtremely thin Small Outline package; No leads)
Note: As indicated, some of these packages are also known as MicroPak.
Note: As indicated, some of these packages are NanoStar compatible.
- Ordering Code Suffix: XSON-6 (0.35mm lead pitch) = GF
- Ordering Code Suffix: XSON-6 (0.5mm lead pitch) = GM
- Ordering Code Suffix: XSON-8 = GT
| SOT Number | Pins | Attributes |
| 6 | Width 1mm, length 1.45mm, height 0.5mm, lead pitch 0.5mm JEDEC MO-252 compliant and MicroPak 6, NanoStar 6 compatible |
| 6 | Width 1mm, length 1mm, height 0.5mm, lead pitch 0.35mm |
| 8 | Width 1mm, length 1.95mm, height 0.5mm, lead pitch 0.5mm JEDEC MO-252 compliant and NanoStar 8 compatible |
| 8 | Wide body, width 3mm, length 2mm, height 0.5mm, lead pitch 0.5mm VSSOP-8 footprint compatible |
More Information
Links
MicroPak and NanoStar are trademarks of Fairchild Semiconductor and Texas Instruments, respectively.
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